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ANSI/IPC 4552-2002 ε°εˆΆη”΅θ·―ζΏη”¨ζ— η”΅ι•€ι•/桸金(EMIG)ι•€ζ•·θ§„θŒƒ
2021-11-08 14:58  ζ΅θ§ˆ:269
 γ€€γ€€θ§„θŒƒηΌ–ε·: ANSI/IPC 4552-2002

γ€€γ€€δΈ­ζ–‡θ§„θŒƒη§°ε·: ε°εˆΆη”΅θ·―ζΏη”¨ζ— η”΅ι•€ι•/桸金(EMIG)镀敷标准

γ€€γ€€ζ›Ώδ»£θ§„θŒƒε·: ,

γ€€γ€€δΈ­ε›½θ§„θŒƒεˆ†η±»ε·: L30

γ€€γ€€θ§„θŒƒε­˜ηœ·ζ¬‘ζ•°: 25欑

γ€€γ€€θ§„θŒƒδΈŠδΌ ζ—₯期: 2011-5-1

γ€€γ€€ε…¬εΈƒζ—₯期: 2002-11-6

γ€€γ€€θ‹±ζ–‡θ§„θŒƒη§°ε·: Specification for Electroless Nickel/Iε¦Ήε¦Ήersion Gold (EMIG) Plating for Printed Circuit Boards

γ€€γ€€θ§„θŒƒη§εˆ«: ηΎŽε›½ε›½εΊ¦θ§„θŒƒ

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